newly launched crypto coins Top Block

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)Iflytek and other robot technology companies have a registered capital of 30 million yuan. According to Tianyancha App, Anhui Lingdong General Robot Technology Co., Ltd. was recently established with Hu Guoping as the legal representative and a registered capital of 30 million yuan. Its business scope includes industrial robot manufacturing, industrial robot sales, intelligent robot research and development, electrical equipment sales, computer software and hardware and auxiliary equipment retail, information system integration services, intelligent robot sales, mechanical equipment leasing, etc. According to shareholder information, the company is jointly held by Anhui Xunfei Yunchuang Technology Co., Ltd., a subsidiary of Iflytek (002230), Anhui Yanzhi Technology Co., Ltd. and Anhui Lingji Wanwu Technology Partnership (Limited Partnership).Korean Air passed the US antitrust review, clearing the way for completing the Asiana Airlines transaction.

According to the analysis of the daily limit at noon on December 12, the Growth Enterprise Market index rose by 1.47% in half a day, and the big financial and consumer stocks collectively strengthened. Shandong Fiberglass and Rishang Group are connected with 7 boards, and one picture can be understood > >Alibaba Central China Headquarters Project has been put into commercial operation. According to the news of China Construction Eighth Bureau, Alibaba Central China Headquarters Project, which was built by China Construction Eighth Bureau, has been put into commercial operation recently. The project is located in Wuchang District, Wuhan City, Hubei Province, with a total construction area of about 452,200 square meters. The format is mainly commercial complex and office space, consisting of two super-high-rise office towers, commercial podium and four-story basement.Shanghai Nickel's main contract has expanded, and now it has risen by more than 3% to 129,170 yuan/ton.

Sino-Vietnamese communication is more convenient! The number of entry-exit personnel at Dongxing Port exceeded 8 million. With the continuous optimization of entry-exit policies, the number of entry-exit personnel at Dongxing Port, the border land port with the largest passenger flow between China and Vietnam, exceeded 8 million. According to the statistics of Dongxing Entry-Exit Frontier Inspection Station, the daily average passenger flow at Dongxing Port exceeds 20,000.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)CITIC Bank: Individual pension fund accounts will be opened in batches for customers who make automatic account opening. CITIC Bank issued a notice that the individual pension system will be fully implemented soon. On the day when the system is fully implemented, we will open individual pension fund accounts in batches for customers who make automatic account opening in our bank. The specific account opening results will be subject to verification by the Ministry of Human Resources and Social Security and our bank. Due to the large number of customers who have reserved automatic account opening, there may be some delay in the account opening result. Please understand.